The COCHISE project consists in designing, modeling and characterizing new connectors for very high speed Ethernet applications (> 10 Gbits/s). This work is part of the problematic of the transfer and processing of ever larger computer data, known as "big-data". It requires infrastructures and equipments always more powerful.

The end equipment (computers, servers, routers) have been the subject of extraordinary improvements in recent decades (speed, memory, etc.). From now on, the interconnection part (cable, optical fiber, or wireless), which is an mandatory step during data transfer, can become a serious blocking point. In this context, a simple connector can become the "weak link" in the transmission chain. It is therefore necessary to constantly develop new connectors that meet the performance requirements of the end devices and comply with the latest standards and targeted data rates, i.e. beyond 10 Gbits/s or even 40 Gbits/s, in order to anticipate future demands.

An electrical connector in communication networks is composed of a metallic envelope and gold and gold pins to carry the signals, but also an insulating part made of a thermoplastic dielectric material. The development and innovation of a new connector requires three distinct fields of expertise

- electromagnetic modeling for design and performance qualification

- development of polymeric materials for the insulator

- micro-mechanics for product shaping.

In order to cover all of these skills, the COCHISE project brings together two mixed research units of the CNRS research units and a leading industrial partner in the connector industry. The two laboratories laboratories bring very complementary skills: IMEP-LAHC (UMR 5130,

University of Savoie Mont Blanc, Chambéry) and IMP (UMR 5223, INSA, Lyon) are espectively specialists in passive components in fast electronics and in the elaboration of polymeric materials. Amphenol-Socapex (Thyez, Haute-Savoie) is a world leader in connectors for telecom and data transmission applications.

In the COCHISE project dedicated to the development of a new Octonet 10 GBASE T type connector, the design part consists in integrating four differential wire pairs (8 pins) into a standard format designed for two wire pairs (4 pins). It is thus a question of keeping the compactness while improving the performances. This step involves reducing the level of crosstalk between the differential pairs, which is a blocking point for increasing data rates. The addition of an extra internal shielding seems to be a promising way. This part is mainly supported by IMEP-LAHC (USMB).

The development of new materials aims at reducing the level of crosstalk. The aim is to thermoform an innovative low cost shielding using a polymer around the wire pairs. The challenge consists in molding these new thermoplastic materials whose properties can be dielectric or conductive according to the desired function in a single piece using a bi-injection press. The IMP (INSA) will lead this step in collaboration with Amphenol-Socapex. The mechanical part concerns the shaping of the connector. It is a question of answering the mechanical constraints and also of making the whole compatible with the industrialization phase. Amphenol-Socapex will ensure this mechanical part and the definition of the product in terms of standards.